OAI的面板级掩模光刻机 Model 6020S

用于FOPLP型号6020S -半自动化或自动化,实现500mm x 500mm晶圆尺寸的FO-PLP加工.

OAI’s Panel Level Mask Aligner for FOPLP Model 6020S - Semi or Automated

Enabling FO-PLP Processing at 500mm x 500mm Wafer Sizes

OAI掩模对准器，不同的印刷方式

距离:间隙可设置在一个非常宽的范围内，增量精度1µM

软接触:•基材被带入非常柔软的机械接触曝光时的掩模。通过接触力可调软件设置

金属触点:•接触额外的氮气压力

真空接触:•真空级别控制接触力。真空度为由用户设置


OAI Mask Aligners
Various Printing Modes

PROXIMITY:
• THE GAP IS SETTABLE OVER A VERY WIDE RANGE WITH AN INCREMENTAL PRECISION OF 1µM

SOFT CONTACT:
• SUBSTRATE IS BROUGHT INTO VERY SOFT MECHANICAL ConTACT WITH THE MASK DURING EXPOSURE. THE ConTACT FORCE IS ADJUSTABLE VIA SOFTWARE SETTINGS

HARD CONTACT:
• ConTACT WITH ADDITIonAL N2 pressure VACUUM CONTACT:
• VACUUM LEVEL ConTROLS THE ConTACT FORCE. LEVEL OF VACUUM IS SET BY USER

afer Sizes