OAI Model 800E 型掩模对准系统

。各种光谱范围选项:Hg灯:G(436nm),H(405nm)， I(365nm)和310nm线，Hg-Xe灯:260nm和220nm

。基片尺寸范围从4“8"直径

。灯功率范围从200到2000W或LED

。电脑操作和配方存储

。易于使用的GUI和多功能操纵杆

。手动对齐在顶部和底部双2 mp GigE摄像机和机动的X-Y-Z-Theta舞台与操纵杆/菜谱操作

。升级到自动对齐w / Cognex软件升级

。楔自动补偿和机动z轴带有 和3点水准升级选项

。红外光学背面对齐选择升级

。接近(20um): 3.0um，软触点:2.0um，硬触点:1um，真空触点:≤0.5um

。提供正面和背面接触和对齐0.5 - 1的准确性

。提供半自动化/研发和低容量生产模式

。适用于MEMS、半导体、Microfludic纳米/印记,PSS衬底和CLiPP流程

Model 800E Mask Aligner System

。 Various Spectra Range Options: Hg Lamp: G (436nm), H (405nm), I(365nm) and 310nm lines, Hg-Xe Lamp: 260nm and 220nm
。 Substrate sizes range from 4" to 8" diameter or square
。 Lamp Power range from 200 to 2,000W or LED
。 PC Operation and Recipe Storage
。 Easy to use GUI and Multifunction Joystick
。 Manual Alignment with Top and Bottom Dual 2MP GigE Cameras and Motorized X-Y-Z-Theta Stage with Joystick / Recipe Operation
。 Upgrade to Auto Alignment w/ Cognex Software Upgrade
。 Automated wedge compensation and motorized z-axis with encoder and option for 3 Point Leveling Upgrade
。 IR Optics Backside Alignment Option upgrade
。 Proximity (20um): <3.0um, Soft Contact: <2.0um, Hard contact: 1um and vacuum contact : ≤ 0.5um
。 Provides Front and backside exposure and alignment accuracy of 0.5-1um
。 Available in semi automated / R&D and low volume production modes
。 Applicable for MEMS, Semiconductor, Microfludic, Nano/Imprinting, PSS Substrate and CLiPP Processes