Sawatec Leaflet_SMD-200 显影机:

外露光刻胶的研制是光刻胶研制过程中 关键的步骤之一，因此对研制过程及其参数(温度、研制时间等)的选择要特别注意。在喷淋显影过程中，对每个基板分别进行单独显影，并在暴露区域连续喷淋新显影剂或蚀刻剂，以防止显影剂饱和。

SAWATEC开发人员可用于水坑或喷雾开发，在此过程中，根据应用程序的技术和经济标准选择 佳流程。与水坑开发相比，喷雾开发的优点是可以释放非常小的精细结构。水坑法的优点是，当衬底有较深的结构时，显着较少的显影液需要和较好的结果。

SMD系列用于清洗和显影8英寸(200mm)以下的晶圆或6英寸(150x150mm)以下的基板。过程——室工作Ø212毫米。

由SAWATEC公司开发的SMD具有良好的工艺性能、低的化学消耗和可靠的重复性，甚至具有较厚的光刻胶层。由于操作简便，易于清洗，这些仪器是理想的适合于实验室，研发，研究所和试点项目。

该仪器可作为台式或移动式机柜。

功能(基本配置)

FEATURES (BASIC CONFIGURATION)

§Up to 50 programmes with 24 segments each can beprogrammed

§Quick start function for repeatprocesses

§User-friendly process configuration with touch screenpanel

§Process parameter: speed, acceleration, process time, speed of the spray arm, developing spraytime

§Electrical driven spray arm, with dynamic or staticfunction

§Developer line and media tank (2 litre) for one developerincluded

§Nozzle for DI-water-rinse and N2 drying on the sprayarm

§Nozzles in the process bowl for the backsiderinse

§Control elements for dosing of the compressed air andvacuum

§Rotational direction can be selected (CW,CCW)

§Manual loading and unloading of thesubstrates

Mechanical substratefixation

§Acoustic signal when the process hasfinished

PERFORMANCE DATA

§Speed range: 0 to 3’000rpm +/-1rpm 1)

§Speed acceleration: 0 to 3’000rpm in 0.3 seconds1)

§Process time up to 2376seconds

§Developer spray time 99seconds/segment

§Speed of the spray arm 10 to200mm/seconds

§Rinse and N2 drying 99seconds/segment

§Heatable process hood up to50°C

§Spray nozzle made of PEEK0,8mm

ADDITIonAL FUNCTIONS (OPTIONS)

§Additional developer lines (up to 4 developer linespossible)

§Start/stop foot switch for ease of operation (cable length1.8m)

§Separation unit for media exhaust (tank and laboratoryequipment)

§Developer tank heating system (2litre)

§Spray nozzle made of PEEK (0,3 /0,5mm)

§Nozzle for puddledeveloping